M-Bond 610 Adhesive System Complete Kit to make 100g total
| Availability | Contact for Availability |
|---|---|
| Item | 05059-AB |
This high-performance two component epoxy-phenolic resin was formulated specifically for bonding strain gages and temperature sensors. When properly cured, this two part adhesive is useful for temperatures ranging from deep cryogenic, -269° C (-452° F) (4° K) to 370° C (700° F) for short periods, and -269° C (-452° F) (4° K) to 260° C (500 °F) for long periods. Note that for transducer applications, the recommended temperature upper limit is 230° C (450° F). Like other organic materials, the higher temperature lifetime is limited by oxidation and sublimation effects.
The M-bond 610 product is prepared by mixing together the two different components, a "curing agent" and the other, the adhesive. Each kit contains four bottles of each of the two components, the "curing agent" coming in 11 gram bottles and the "adhesive" coming in 14 gram bottles. When used, one bottle of each component is required to make up a total of 25 grams of working adhesive. A total of 100 grams is present in each kit. In addition, each kit contains 4 brush caps for dispensing mixed adhesives and 4 disposable mixing funnels. Each kit comes with mixing instructions, surface preparation instructions, and shelf and pot life information. One should pay particularly close attention to the elongation capabilities and handling precautions.
Now for specific information about the use of M-Bond 610, for the preparation of wafer cross-sections, while the original instructions call for cure conditions of 150°C (302°F) for some several hours or more, it is reported that experienced persons making TEM cross-sections routinely cure at 70°C (158°F) for less than one hour. And for those TEM samples that can not withstand any heating whatsoever, it is reported that acceptable cures are possible at room temperature, "over night". And of course, the cured polymer is acetone insoluble.
We realize that sometimes for these non-strain gage applications, information such as thermal coefficient of expansion or electrical resistivity would be useful. But, such information is not needed for the application that M-Bond 610 was originally developed, and such data does not exist so far as we know.
An understated potential safety risk:
We are addressing now the cured block, something that to most people is about as inert of a material as one will find. But the standard practice in many laboratories is to use a small jeweler's (or even a small hack) saw to cut the block down to the right size, sometimes even to shape it. We want to address the dust that is generated and how its exposure can and should be minimized.